Method for bonding zircon substrates

US8956484B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• William Peter Addiego · Big Flats, US
• Michael John Bennett · Corning, US
• Michael Patrick Carson · Corning, US
• Jeffrey Scott Davis · Corning, US
• Martin Herbert Goller · Corning, US
• Benjamin Zain Hanson · Big Flats, US
• Tracey Lynn Timmons · Big Flats, US

Key dates

• Filing date: Nov 26, 2012
• Grant date: Feb 17, 2015
• Expiry date: Apr 2, 2033

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C04B2237/80
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Disclosed herein are methods for bonding refractory substrates, such as zircon substrates, without the use of a bonding agent. Exemplary methods include (a) providing a plurality of refractory components, each component having at least one surface to be bonded, (b) polishing each surface to be bonded to a surface roughness (Ra) of 200 nm or finer, (c) contacting the surfaces to be bonded to form an unbonded refractory substrate, (d) firing the unbonded refractory substrate, and (e) subjecting the surfaces to be bonded to a compressive force during firing. Methods for making refractory forming bodies are also disclosed herein.