Use of dams to improve yield in film processing
US8956685B2 · kind B2 · utility
8Cited by
6References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2010 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Jun 1, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The present invention relates to methods for forming films. In particular, the present invention relates to the formation of films on a substrate, the substrate having at least one dam portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.