Patent · US Active

Surface treatment method for metal substrate and coated article manufactured by the same

US8956721B2 · kind B2 · utility

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Key dates

Filing dateDec 19, 2012
Grant dateFeb 17, 2015
Priority date
Expiry dateMay 29, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/265
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A surface treatment method for metal substrate includes: a metal substrate is provided; a first color layer is deposited on the metal substrate, the first color layer being a TiC layer or a TiN layer; a second color layer is deposited on the first color layer, the first color layer being a CrC layer or a CrN layer, the color of the first color layer being different from the color of the second color layer; forming a shielding layer on partially of the second color layer; electrochemical etching the metal substrate, the second color layer not covered with the shielding layer being removed to form a recessed portion, the recessed portion being extend through the second color layer. A coated article for manufactured by the surface treatment method is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.