Hole formation method, multilayer wiring, semiconductor device, display element, image display device, and system containing via hole formed by the hole formation method
US8956969B2 · kind B2 · utility
3Cited by
0References
9Claims
0Family size
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Key dates
| Filing date | Feb 14, 2012 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Oct 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hole formation method including applying a pillar-forming liquid to a base material, to thereby form a pillar; applying an insulating film-forming material to the base material on which the pillar has been formed, to thereby form an insulating film; removing the pillar to form an opening in the insulating film; and heat treating the insulating film in which the opening has been formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.