Patent · US Active

Polyamide moldings comprising microencapsulated latent-heat-accumulator material

US8957133B2 · kind B2 · utility

1Cited by

7References

28Claims

0Family size

Assignee

BASF SE

Inventors

Philippe Desbois · Maikammer, DE
Tina Schröder-Grimonpont · Rheinzabern, DE
Stephan Altmann · Grafenwöhr, DE
Marco Schmidt · Stuttgart, DE

Key dates

Filing date	Jul 18, 2011
Grant date	Feb 17, 2015
Priority date	—
Expiry date	Dec 31, 2031

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/02
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to polyamide moldings obtainable via anionic polymerization of a lactam comprising microcapsules with a capsule core made of latent-heat-accumulator material and a polymer as capsule wall, to a process for producing the same, and also to the use of the same in motor-vehicle construction, as battery housing, as housing for small electronic devices, and for heat-retention systems for foods.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.