Polyamide resin composition having excellent photostability and discoloration resistance
US8957142B2 · kind B2 · utility
2Cited by
2References
13Claims
0Family size
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Key dates
| Filing date | Oct 30, 2013 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Oct 30, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2241
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition includes (A) a semi-aromatic polyamide resin, (B) an inorganic filler, (C) a white pigment and (D) a phosphinate salt. The polyamide resin composition can have excellent heat resistance, reflectance, photostability and/or discoloration resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.