Electrical component assembly for thermal transfer
US8957316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2010 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Dec 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Example electrical component assemblies are described. In some examples, the electrical component assembly may include a printed board and an electrical component on the printed board, the electrical component defining a first surface adjacent the printed board and one or more second surfaces other than the first surface. The assembly may also include a thermal bridge comprising a plurality of vias extending through the thermal bridge, and a thermally conductive member interposed between the one or more second surfaces of the electrical component and the thermal bridge. In some examples, the thermally conductive member extends at least partially through the plurality of vias of the thermal bridge. During operation of the electrical component, the assembly configuration may facilitate thermal transfer from a first direction defined by the thermally conductive member to a second direction defined by the thermal bridge to transfer thermal energy away from a surface of the electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.