Laser machining device and laser machining method
US8957349B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2009 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | May 17, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03H2240/53
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser machining device is provided with a laser light source, a spatial light modulator, a driving unit, a control unit, and a condensing optical system. The control unit selects a basic hologram corresponding to each basic machining pattern included in a whole machining pattern in a workpiece from a plurality of basic holograms stored by the storage unit, and determines a display region of the basic hologram in the spatial light modulator so that the deviation of the value of “Iη/n” becomes small for the selected respective basic hologram when the intensity of a laser beam input to a display region of the basic hologram in the spatial light modulator is defined as I, the diffraction efficiency of the laser beam in the basic hologram is defined as η, and the number of condensing points in a basic machining pattern corresponding to the basic hologram is defined as n.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.