Sulfuration resistant chip resistor and method for making same
US8957756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2013 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Aug 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/288
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.