Floor-to-ceiling partition wall assembly
US8959859B2 · kind B2 · utility
10Cited by
57References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2013 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Sep 17, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T292/096
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A panel wall system includes a frame assembly adapted to support a plurality of skin assemblies in a floor-to-ceiling relationship, wherein the skin assemblies include solid panel assemblies as well as captured glass skin assemblies. The solid panel assemblies are coupled to the frame assembly with seal members disposed between the panel assemblies and the frame assembly. The seal members are unitary seal members able to seal adjacent panel assemblies on the frame assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.