Flux for soldering and soldering process
US8960526B2 · kind B2 · utility
1Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Mar 6, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation.Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.