Assembling thin silicon chips on a contact lens
US8960899B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 26, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Oct 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2065
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.