Method and device for plasma treating workpieces
US8961688B2 · kind B2 · utility
0Cited by
13References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2003 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Jun 9, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2300/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are a method and a device for plasma treating workpieces (5). Said workpiece is inserted into a chamber (7) of a treatment station (3), which can be at least partly evacuated, and is positioned within the treatment station by means of a holding element. In order to simultaneously supply at least two chambers with at least one operating means, a flow of the operating means is branched at least once so as to form at least two partial flows (55).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.