Method for guiding and bonding strands to a substrate
US8961720B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Apr 30, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H57/16
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method of bonding first and second strands onto a substrate traveling along a machine direction in a plane of travel. The method includes moving the first and second strands in the machine direction relative to a nozzle having a nozzle body with first and second liquid discharge passages, and first and second side-by-side notches. The first and second strands are guided for movement by engaging closed ends of the respective first and second notches. Open ends of the first and second notches are oriented or directed non-perpendicular to the plane of travel of the substrate. Liquid adhesive is dispensed onto the first and second strands from the liquid discharge passages and the first and second strands are bonded to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.