Patent · US Active

Pressure-sensitive adhesives for bonding printing plates

US8962777B2 · kind B2 · utility

3Cited by

1References

16Claims

0Family size

Assignee

tesa SE · DE

Inventors

Kai Ellringmann · Hamburg, DE
Marco Kupsky · Quickborn, DE

Key dates

Filing date	Mar 4, 2010
Grant date	Feb 24, 2015
Priority date	—
Expiry date	Mar 4, 2030

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2301/302
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Crosslinked pressure-sensitive adhesive comprising at least one base polymer component obtainable by free-radical copolymerization of the following monomers:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.