Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
US8963180B2 · kind B2 · utility
1Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Mar 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.