Semiconductor device
US8963324B2 · kind B2 · utility
3Cited by
16References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2014 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Mar 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the cooler. The cooler has a pressed part in which the semiconductor module is pressed, and a strut fixing part to which the strut is fixed. The strut fixing part has higher rigidity than the pressed part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.