Semiconductor device including wiring board with semiconductor chip
US8963327B2 · kind B2 · utility
1Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2013 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Apr 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes lands having an NSMD (non-solder mask defined) structure for mounting thereon solder balls placed in an inner area of a chip mounting area. The lands for mounting thereon solder balls are placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view. The semiconductor device is mounted on a mounting substrate with the balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.