Thin wafer support assembly
US8963337B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2010 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Mar 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6836
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer assembly formed by bonding a support wafer to a thin wafer using a double-sided bonding release tape. The support wafer provides support for the thin target wafer such that existing handling tools can accommodate transporting and processing the assembly without compromising the profile of the thin target wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.