Wiring board
US8963672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Jun 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.