Method for producing a microstructure on a carrier

US8964296B2 · kind B2 · utility

Assignee

• GIESECKE & DEVRIENT GMBH · DE

Inventors

• Winfried Hoffmuller · Bad Tölz, DE
• Theodor Burchard · Tegernsee, DE
• Michael Rahm · Bad Tölz, DE
• Josef Schinabeck · Tegernsee, DE
• Manfred Heim · Munich, DE
• Andreas Rauch · Ohlstadt, DE
• Christian Fuhse · Otterfing, DE

Key dates

• Filing date: May 5, 2011
• Grant date: Feb 24, 2015
• Expiry date: Feb 23, 2032

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B42D2035/44
• WIPO field: Other consumer goods
• WIPO sector: Other fields

Abstract

A method for producing a microstructure on a carrier by: (a) manufacturing a donor foil by forming an embossed structure with elevations and depressions in a first foil material and applying a transfer layer to the embossed structure, (b) manufacturing an acceptor foil by applying an adhesive layer to a second foil material, (c) laminating the donor foil and the acceptor foil by means of the adhesive layer, the transfer layer on the elevations of the embossed structure bonding to the adhesive layer, and (d) transferring the bonded regions of the transfer layer to the acceptor foil by separating the donor foil and the acceptor foil from each other, thereby forming in the acceptor foil a first microstructure from the transferred regions of the transfer layer, and/or forming in the donor foil a second microstructure complementary to the first microstructure.