Method of joining magnesium
US8966734B2 · kind B2 · utility
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21References
21Claims
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Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Mar 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4998
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of joining a magnesium substrate to a second substrate are provided. A region of the magnesium substrate and a region of the second substrate are aligned to provide an overlap. A region of the overlap is deformed to provide a joint. A polymeric material is disposed in the joint to secure together the magnesium substrate and the second substrate. The joining of the magnesium substrate and the second substrate is facilitated by using a die in various aspects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.