Method for repairing a sound attenuation panel
US8967330B2 · kind B2 · utility
6Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2013 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Jul 30, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49718
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for repairing a sound attenuation panel is disclosed. The panel includes a structuring skin in metal material, a resistive layer in metal material and a honeycomb structure as acoustic absorption material directly added onto the structuring skin and resistive layer. The method includes a step in which one reinforcing pin is inserted into the thickness of the attenuation panel and a step in which the reinforcing pin is secured by welding in a controlled atmosphere to the structuring skin and resistive layer respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.