Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components
US8967453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2012 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Dec 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8384
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.