Heat dissipating device supporting apparatus
US8967586B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 26, 2012 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Feb 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.