Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board
US8968006B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2013 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Jul 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0228
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.