Capacitive sensing button on chip
US8970230B2 · kind B2 · utility
29Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2011 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Jul 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/960755
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An embodiment of an integrated circuit device may comprise an integrated circuit package, a sensor element attached within the integrated circuit package, a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.