Patent · US Active

Hermetically sealed radio-frequency front end

US8971056B2 · kind B2 · utility

1Cited by
10References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 18, 2010
Grant dateMar 3, 2015
Priority date
Expiry dateMar 11, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.