Hermetically sealed radio-frequency front end
US8971056B2 · kind B2 · utility
1Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2010 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Mar 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.