Patent · US Active

Method for analyzing growth of void of resin in a porous material

US8972226B2 · kind B2 · utility

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24Claims
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Key dates

Filing dateSep 7, 2011
Grant dateMar 3, 2015
Priority date
Expiry dateJan 4, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02T10/82
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

The present invention provides a method for analyzing growth of void of resin in a porous material which comprising the steps of inputting data of the shape of a porous material filled with a resin material, and dividing the shape of the porous material into three-dimensional solid elements; inputting physical properties of the porous material, and boundary conditions including a pressure that is applied to the porous material; obtaining a resin-density distribution in the porous material through fluid analysis using a database obtained by experimentally measuring in advance a temporal change in a volume of gas generated from the resin material and porous material during heating, changes in a compressive force and compressive displacement respectively occurring when the porous material impregnated with the resin is compressed, and a change in a flow resistance of the resin; and comprehensively grasping production, growth, and distribution of voids deriving from gas generation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.