Method for manufacturing composite piezoelectric substrate
US8973229B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2009 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Aug 7, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a composite piezoelectric substrate in which a piezoelectric substrate and a supporting substrate are prepared, ions are implanted in the piezoelectric substrate to form a defective layer at a predetermined depth in the piezoelectric substrate, impurities that are adhered to a surface of the piezoelectric substrate or a surface of the supporting substrate are removed to expose the constituent atoms thereof and to activate the surfaces, the supporting substrate is bonded to the piezoelectric substrate to form a bonded substrate body, the bonded substrate body is separated at the defective layer so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate and bonded to the supporting substrate to form a composite piezoelectric substrate, and the surface of the separation layer of the composite piezoelectric substrate is smoothed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.