Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool
US8973807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2011 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Apr 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.