Patent · US Active

Mold for thermal nanoimprint lithography, process for fabricating the same, and nanoimprint process using the same

US8974215B2 · kind B2 · utility

1Cited by

2References

28Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Stefan Landis · Tullins, FR
Sergio Nicoletti · Le Pont-de-Claix, FR

Key dates

Filing date	Sep 7, 2011
Grant date	Mar 10, 2015
Priority date	—
Expiry date	Feb 11, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB82Y40/00
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A heating mold for thermal nanoimprint lithography is disclosed. According to one aspect, the mold includes a resistive heating element and collecting element for collecting the electromagnetic energy of a variable electromagnetic field emitted by a source located outside the mold. The collecting element being connected to the resistive heating element in which the electromagnetic energy is dissipated. A method for manufacturing the mold, a thermal nanoimprint lithography device including the mold, and a a method for preparing a substrate including a surface nanostructured by a thermal nanoimprint lithography technique using the mold is applied are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.