Method of depositing organic material
US8974858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2013 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Jul 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/441
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.