Selective deposition of metal on plastic substrates
US8974860B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jun 19, 2009 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Aug 1, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.