Electronic assembly including an embedded electronic component

US8975116B2 · kind B2 · utility

Assignees

• TECHNISCHE UNIVERSITÄT BERLIN · DE
• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Andreas Ostmann · Berlin, DE
• Dionysios Manessis · Berlin, DE
• Lars Böttcher · Schwarzenberg, DE
• Stefan Karaszkiewicz · Berlin, DE

Key dates

• Filing date: Dec 14, 2010
• Grant date: Mar 10, 2015
• Expiry date: Sep 19, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/0353
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic unit is produced including at least one electronic component at least partially embedded in an insulating material. A film assembly is provided with at least one conductive layer and a carrier layer. The conductive layer includes openings in the form of holes for receiving bumps, which are connected to contact surfaces of the at least one electronic component. The at least one component is placed on the film assembly such that the bumps engage with the openings of the conductive layer. The at least one component is partially embedded from the side opposite of the bumps into a dielectric layer. The carrier layer of the film assembly is removed such that the surface of the bumps is exposed. A metallization layer is then deposited on the side of the remaining conductive layer having the exposed bumps and so as to produce conductor tracks that overlap with the bumps.