Moulding compound for mouldings with high weather resistance

US8975337B2 · kind B2 · utility

Assignee

• Evonik Röhm GmbH · DE

Inventors

• Werner Hoess · Griesheim, DE
• Michael Wicker · Seeheim-Jugenheim, DE
• Klaus Schultes · Wiesbaden, DE
• Klaus Albrecht · Mainz, DE
• Martin Mohrmann · Weiterstadt, DE

Key dates

• Filing date: Sep 23, 2011
• Grant date: Mar 10, 2015
• Expiry date: Sep 23, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31909
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A molding compound comprises a copolymer (I)a), produced by polymerization of 90-100% by weight methylmethacrylate, styrene and malic acid anhydride, and optionally 0-10% by weight additional monomers which can be copolymerized with methylmethacrylate, a (co)polymer (II)b), produced by polymerization of 80-100% by weight methylmethacrylate and optionally 0-20% by weight additional monomers which can be copolymerized with methylmethacrylate, and has a solution viscosity in chloroform at 25° C. (ISO 1628 Part 6) of 50 to 55 ml/g, as well as c) optional conventional additives, auxiliary agents and/or fillers. The molding compound is characterized in that the copolymer (I) has a solution viscosity in chloroform at 25° C. (ISO 1628 Part) of 55 ml/g or less. Also disclosed are moldings produced by thermoplastic processing of the molding compound and their uses.