System and method for monitoring LED chip surface roughening process
US8976366B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2012 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Oct 5, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B21/0092
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.