Heat sink mount for laser diode
US8976825B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Jan 13, 2014 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Jan 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02212
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A heat sink mount for a laser diode comprises three main components, a diode ring, a diode bed and a diode container. The diode ring comprises an inner hole that matches a metal stem part of the laser diode. The diode bed comprises a first part and a second part. The diode ring is fitted into the first part of the diode bed. The inner surface of the first part is tightly contacting the outer surface of the diode ring. The diode container comprises a part a and a part b. The diode bed is fitted into the part a of the diode container, via the gripping contact between the thread on the inner surface of the part a and the thread on the outer surface of the second part of diode bed. This heat sink mount has lower costs and higher heat dissipation efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.