Headset microphone boom assembly
US8976957B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2013 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Sep 17, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present arrangements relate to a microphone boom assembly. A first microphone can be positioned proximate to a first aperture defined in a first side of the microphone boom through which acoustic signals propagate to the first microphone, and a second microphone can be positioned proximate to a second aperture defined in a second side of the microphone through which the acoustic signals propagate to the second microphone. The first microphone can be connected to a first side of a flexible printed circuit at a first location and the second microphone connected to a second side of the flexible printed circuit at a second location, the flexible printed circuit mounted into the microphone boom with a bend in the flexible printed circuit positioned between the first location and the second location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.