Hot-wire sensor of submillimeter size and associated method of production
US8978462B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 11, 2011 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | May 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a submillimeter-sized hot-wire sensor (1) comprising a substrate (10), two support rods (11, 12), a metal wire (13) extending between the two ends of the support rods (11, 12), and electrical contacts (14, 15) disposed on the support rods, said contacts each being linked to one of the ends of the wire (13). The metal wire comprises at least two layers of metal materials, one of said layers being made of a material exhibiting a residual stress under tension and the other layer being made of a material exhibiting a residual stress under compression. The thicknesses of these metal layers are adapted so as to compensate the residual stresses between the various layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.