Method for cutting panel substrate and substrate cutting apparatus
US8978528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2011 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Jan 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.