Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
US8978742B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 16, 2012 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Dec 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53122
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112′) and an attaching plane (113′) perpendicular to each other, coating an adhesive (50) on the contact planes (112′), connecting the contact planes to make the attaching planes co-planar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.