Process for manufacturing a contactless smartcard having a transparent logo
US8978986B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 7, 2013 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Oct 7, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multilayer contactless smartcard 10 including an electronic chip embedded in the card, the chip being connected to an antenna 22 printed on a carrier layer 20, and two card bodies, one on each side of the carrier, each including at least one plastic layer 40 and 60. The antenna carrier is opaque and includes a first cut-out forming a void 23 filled with a transparent plastic; and the plastic layers of the two card bodies each include a second cut-out forming two identical voids 43 and 63 the outlines of which superimpose, in order to make a transparent zone appear in the thickness of the card, forming a transparent logo in the shape of the cut-out. A process for manufacturing such a card is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.