Nano-fabricated structured diamond abrasive article
US8979613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2009 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | May 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention describes a microfabricated or nanofabricated structured diamond abrasive with a high surface density array of geometrical protrusions of pyramidal, truncated pyramidal or other shape, of designed shapes, sizes and placements, which provides for improved conditioning of CMP polishing pads, or other abrasive roles. Three methods of fabricating the structured diamond abrasive are described: molding of diamond into an array of grooves of various shapes and sizes etched into Si or another substrate material, with subsequent transferal onto another substrate and removal of the Si; etching of an array of geometrical protrusions into a thick diamond layer, and depositing a thick diamond layer over a substrate pre-patterned (or pre-structured) with an array of geometrical protrusions of designed sizes, shapes and placements on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.