Polycrystalline diamond compact
US8979956B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Jul 29, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C33/26
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table having an upper surface, an interfacial surface, and at least one side surface extending therebetween. The interfacial surface of the polycrystalline diamond table is bonded to the substrate. The polycrystalline diamond table includes bonded diamond grains defining interstitial regions. The polycrystalline diamond table includes a first region extending inwardly from at least a portion of the upper surface and at least a portion of the at least one side surface. The first region spaced from the interfacial surface. The polycrystalline diamond table includes at least a second region extending inwardly from the interfacial surface to the upper surface. The first region includes at least a first infiltrant disposed interstitially between the bonded diamond grains thereof. The second region includes at least a second infiltrant disposed interstitially between the bonded diamond grains thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.