Patent · US Active

Method and arrangement for redundant anode sputtering having a dual anode arrangement

US8980072B2 · kind B2 · utility

0Cited by

5References

7Claims

0Family size

Assignee

VON ARDENNE Anlagentechnik GmbH · DE

Inventors

Goetz Teschner · Gelnhausen, DE
Enno Mirring · Radeberg, DE
Johannes Struempfel · Dresden, DE
Andreas Heisig · Dresden, DE

Key dates

Filing date	Sep 25, 2008
Grant date	Mar 17, 2015
Priority date	—
Expiry date	Nov 8, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3444
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

In a method in which two anodes are operated alternately opposite each other as plasma discharge anodes and as cathodes for self-cleaning, and the cathodes of the plasma discharge are recurrently briefly reversed in polarity, and an arrangement comprising a cathode and a first and a second anode supplied with voltage by an H-bridge circuit, pole reversal of cathode voltage is effected by a pulse current supply, at least one anode is maintained at positive potential at all times and the other anode intermittently at negative potential during an etching time, and the H-bridge circuit is operationally connected to the pulse current supply, such that at least one anode is at positive potential at all times.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.