Plating bath and method
US8980077B2 · kind B2 · utility
8Cited by
12References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 30, 2012 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Feb 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.