Methods and electrolytes for electrodeposition of smooth films

US8980460B2 · kind B2 · utility

Assignee

• Battelle Memorial Institute · CH

Inventors

• Jiguang Zhang · Xuzhou, CN
• Wu Xu · Richland, US
• Gordon L. Graff · West Richland, US
• Xilin Chen · Richland, US
• Fei Ding · Thalwil, CH
• Yuyan Shao · Richland, US

Key dates

• Filing date: Jun 13, 2012
• Grant date: Mar 17, 2015
• Expiry date: Jun 27, 2032

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D13/22
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.