Cutting fluids with improved performance
US8980809B2 · kind B2 · utility
0Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Feb 5, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10N2040/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The cutting of semiconducting crystals with a wire saw is facilitated with a cutting fluid comprising a polyalkylene glycol neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.