Modified polyamide composition comprising at least one phenolic compound
US8980996B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 22, 2010 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Jun 22, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/1345
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A phenolic compound for manufacturing a modified polyamide that has an increased degree of crystallinity is described. A polyamide composition comprising at least one such phenolic compound and optionally reinforcing fillers or extenders is also described. The composition is preferably a composition to be molded, for example in the form of granules or powder, that is used for the manufacture of articles by an injection-molding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.